Peças electrónicas : W4NXE8C-LD00

Fabricante : Cree

Packing :

Pins :

Descrição : Diameter 76.2mm; low micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition

Temperatura : Min °C | Max °C

Datasheet : W4NXE8C-LD00 PDF

• W4NXE8C-0D00
• W4NXE8C-LD00
• W4NXE8C-SD00